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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0021

CB Certificate n�:
E071/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123000/300/200/100

Issue No.:

Date of Issue of Detail Specification: 1992/01/01

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards:
Multi-layer
Double-sided with plated-through holes
Single and double-sided with plain holes

Manufacturer:

Lyncolec Limited
Hatton Gardens Industrial Estate
Kington
Herefordshire
HR5 3RB
United Kingdom

Capability Manual Reference No:

CM1 Issue 6

Manufacturer's Approval No:

M1028 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation:

Issue date: 2007/05/03


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0021	Issue No.: 4
		Page 2 of 2

Abstract of description of capability:

Board Types:
Single and double-sided with plain holes CECC 23100-003
Double-sided with plated-through holes    CECC 23200-003
Multi-layer      CECC 23300-003
-
Base Materials:  Epoxide Woven Glass
-
Board Size:
457.2 mm   x   405.5 mm  Maximum  BS EN 123 300
430 mm   x   375 mm  Maximum  BS EN 123 100, 200
-
Conductors:
Minimum Width:    200 �m    �50 �m
Minimum Spacing:     200 �m    �50 �m
-
No. of Layers:  8  Maximum
-
Plated-through Hole Diameter:
0.6 mm   Finished  for component mounting
0.4 mm  Drilled  via hole
-
Aspect Ratio:  5.3  :   1  Maximum
-
Finishes:
*Electroplated Tin-Lead
Hot air solder levelling
Hot air solder levelling
5 �m Gold over Copper
Electroless Nickel and Immersion Gold
Liquid Photopolymer Solder Resist
Solder Resist; Two Part, heat Cured
Marking Ink; UV Cured
-
*This finish meets the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.

Upload additionnal document:

Manufacturer :

Lyncolec Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation:

Issue date: 2007-05-03

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