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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
For rules and details of the IECQ visit
www.IECQ.org
IECQ Certificate n°:
C-IECQ BSI 06.0007
CB Certificate n°:
022/QCA
Issue No.:
4
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Status:
Cancelled
Page
1
of
2
Generic/Sectional Specification No.:
BS 123000 Assessment Level C Incorp ANSI/IPC-A-600F Class 2
Issue No.:
0
Date of Issue of Detail Specification:
Code(s) & Titl
e(s):
Description of the
technology
:
Flexible Printed Boards:
-Multi-layer
-Double-sided with through connections
-Single and double-sided without through connections
Flex-rigid Printed Boards
-Multi-layer
-Double-sided with through connections
Rigid Printed Boards:
-Multi-layer
-Double-sided with plated through holes
-Single and double-sided with plain holes
Manufacturer:
Stevenage Circuits Limited
Caxton Way
Stevenage
Hertfordshire
SG1 2DF
United Kingdom
Capability Manual Reference No:
Manufacturer's Approval No
:
THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:
Board Types:
Flexible Multi-layer -BS 123800-003
Flex-rigid double-sided with through connections- BS 123700-003
Flex-rigid Multi-layer- BS 123600-003
Flexible double-sided with through connections- BS 123500-003
Flexible single and double-sided without through connections-BS 123400-003
Rigid Multi-layer -BS 123300-003
Rigid double-sided with plated through holes -BS 123200-003
Rigid single and double-sided with plain holes -BS 123100-003
-
(The use of National Standards is permitted by the Basic Rules of the IECQ Systems; QC 001001:1998 clause 12.1)
-
Base Materials:
Epoxide Woven Glass
Polyimide Woven Glass
Polyimide Film
-
Board Size: 495 mm x 420 mm Maximum
-
Conductors:
Minimum Width: 75 µm ±25 µm
Minimum Spacing:100 µm ±25 µm
-
No. of Layers:24 Maximum
-
Plated through hole diameter: 100 µm Minimum finished via hole
-
Aspect Ratio: 11 : 1 Maximum
-
Finishes:
Hot Air Solder Levelling
Immersion Silver
Immersion Tin
Immersion Gold; Electroless Nickel
2.5 µm Gold over Copper Edge Contacts
0.8 µm Gold over 5µm Nickel Edge Contacts
Liquid Photopolymer Solder Resist
Legend; UV or Thermal Cured
-
Additional: *Blind via holes; mechanically drilled; 18 µm minimum copper plating
*Blind via holes; laser drilled; 13 µm minimum copper plating
*Buried via holes; laser drilled; 13 µm minimum copper plating
* These via holes satisfy the change of resistance requirements of IEC 60326-2 test method 3c.
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the
Official IECQ Website
.
Date of
cancellation
:
Issue date:
2006/04/13
- PAGE BREAK -
IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
For rules and details of the IECQ Scheme visit
www.IECQ.org
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Certificate No.:
C-IECQ BSI 06.0007
Issue No.:
4
Page
2
of
2
Abstract of description of
capability
:
Upload additionnal document:
Manufacturer
:
Stevenage Circuits Limited
Place
:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.
Date of
cancellation
:
Issue date:
2006-04-13
Copyright © IEC-IECQ 2024 , Geneva Switzerland. All rights reserved.
This Certificate has intentionally NOT been printed as the Certificates are the property of the issuing CB.
For further information or to request a copy of a Certificate please contact the relative issuing CB.
http://www.iecq.org/membership/participating_countries/