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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
For rules and details of the IECQ visit
www.IECQ.org
IECQ Certificate n°:
C-IECQ BSI 05.0002
CB Certificate n°:
E073/CA
Issue No.:
4
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Status:
Cancelled
Page
1
of
2
Generic/Sectional Specification No.:
BS 123000 : 2001 Assessment Level C, Incorporating the requirements of ANSI / IPC-A-600F Class 2
Issue No.:
0
Date of Issue of Detail Specification:
Code(s) & Titl
e(s):
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
Description of the
technology
:
Rigid Printed Boards:
Single and double sided with plain holes
Manufacturer:
D J Circuits Limited
Jubilee Works
Anchor Road
Harrogate
North Yorkshire
HG1 4TA
United Kingdom
Capability Manual Reference No:
DJC/01/CM Issue: 18 Date: 08 March 2004
Manufacturer's Approval No
:
M1006 IECQ-CECC
THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the
Official IECQ Website
.
Date of
cancellation
:
2006-11-28
Issue date:
2004/11/09
- PAGE BREAK -
IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
For rules and details of the IECQ Scheme visit
www.IECQ.org
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Certificate No.:
C-IECQ BSI 05.0002
Issue No.:
4
Page
2
of
2
Abstract of description of
capability
:
Board Types: Single and double sided with plain holes BS 123100-003
Base Materials: Epoxide woven glass
Phenolic paper
Epoxide Woven/Non-woven glass composite
Epoxide woven glass with epoxide paper core
Epoxide paper
Board Size: 605 mm x 509 mm maximum
Conductors: Minimum width: 150 µm
Minimum spacing: 150 µm
Finishes: Roller coated tin-lead
*Hot air solder levelling
Copper with temporary protective coating
Component legend; UV cured
Solder resist; UV cured
Peelable solder mask; IR cured
Carbon conductive ink; IR cured
* This finish meets the solderability requirements of IEC 60326-2; Test methods 14b and 20a.
Upload additionnal document:
Manufacturer
:
D J Circuits Limited
Place
:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.
Date of
cancellation
:
2006-11-28
Issue date:
2004-11-09
Copyright © IEC-IECQ 2024 , Geneva Switzerland. All rights reserved.
This Certificate has intentionally NOT been printed as the Certificates are the property of the issuing CB.
For further information or to request a copy of a Certificate please contact the relative issuing CB.
http://www.iecq.org/membership/participating_countries/