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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 06.0001

CB Certificate n�:
023/QCA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123000

Issue No.:

Date of Issue of Detail Specification: 1992/04/01

Code(s) & Title(s):

PWB FLWCU - printed wiring boards, flexible single-sided and double-sided without through connections
PWB FRDTU - printed wiring boards, flex-rigid double-sided with through connections

Description of the technology:

BS EN 123 000
BS EN 123 500
BS EN 123 400
Flexible Printed Boards:
With through connections
Without through connections

Manufacturer:

Flex-Ability Limited
16 Prospect Way
Park View West Industrial Estate
Hartlepool
Cleveland
TS25 1UD
United Kingdom

Capability Manual Reference No:

ACM 00020

Manufacturer's Approval No:

M1012 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation:

Issue date: 2006/04/24


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 06.0001	Issue No.: 4
		Page 2 of 2

Abstract of description of capability:

Board Types:
Flexible double sided with through connections        BS 123500-003
Flexible single and double sided without through
Connections                                                                    BS 123400-003
-
Base Materials:
Polyimide Film  Base and Stiffener
Epoxide Woven Glass  Rigidiser
-
Board Size:  270 mm    x    410 mm           Maximum
-
Conductors:
Minimum Width:        100 �m � 50 �m
Minimum Spacing:  100 �m � 50 �m
-
Plated through  0.40 mm  Minimum component hole
hole diameter:  0.25 mm       Minimum drilled via hole
-
Finishes:
*Bare Copper
*Hot Air Solder Levelling
Adhesive Coated Film Coverlayer
Liquid Photopolymer Solder Resist
Marking Ink
-
*  These finishes satisfy the solderability requirements of IEC 60326-2; test methods 14b and 20a.

Upload additionnal document:

Manufacturer :

Flex-Ability Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation:

Issue date: 2006-04-24

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