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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
For rules and details of the IECQ visit
www.IECQ.org
IECQ Certificate n°:
C-IECQ BSI 05.0004
CB Certificate n°:
019/QCA
Issue No.:
5
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Status:
Cancelled
Page
1
of
2
Generic/Sectional Specification No.:
BS 123000 Assessment Level C, ANSI/IPC-A-600F Class 2
Issue No.:
0
Date of Issue of Detail Specification:
Code(s) & Titl
e(s):
PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes
Description of the
technology
:
BS 123000 : 2001 Assessment Level C
Incorporating the requirements of ANSI / IPC-A-600F Class 2
Manufacturer:
Circast Electronics Limited
Ramsey Road
Sydenham Industrial Estate
Leamington Spa
CV31 1PG
United Kingdom
Capability Manual Reference No:
CM Issue 13
Manufacturer's Approval No
:
M1063 IECQ-CECC
THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the
Official IECQ Website
.
Date of
cancellation
:
Issue date:
2007/05/10
- PAGE BREAK -
IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
For rules and details of the IECQ Scheme visit
www.IECQ.org
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Certificate No.:
C-IECQ BSI 05.0004
Issue No.:
5
Page
2
of
2
Abstract of description of
capability
:
Board types:
Rigid Single and double sided with plain holes BS 123100-003
Rigid Double sided with plated-through holes BS 123200-003
Rigid Multilayer BS 123300-003
(The use of National Standards is permitted by the Basic Rules of the IECQ System; QC 001001 : 1998 clause 12.1)
-
Materials: Epoxide Woven GlassPolyimide Woven Glass
-
Board Size:
540 mm x 480 mm Maximum Multilayer
540 mm x 480 mm PTH & non PTH
No. of Layers:
24 Maximum Epoxide Woven Glass
18 Maximum Polyimide Woven Glass
-
Conductors:
Minimum Width 100 µm ±50 µm
Minimum Spacing 100 µm ±50 µm
-
Plated-through hole: Minimum Diameter 0.3 mm finished hole
-
Aspect Ratio: 11 : 1 Maximum
-
Finishes:
*Hot Air Solder Levelling
Electroless Nickel; Immersion Gold
2.5 µm Gold on Copper Edge Contacts
2.5 µm Gold on 5µm Nickel Edge Contacts
Liquid Photopolymer Solder Resist
Wet Film Solder Resist
Legend; Photo-imageable
Legend; Oven cured.
-
Additional Features:
Bonded Heatsinks:Anodised Aluminium, Nickel plated Copper
Blind and Buried via holes (sequential build)
Controlled Impedance (see supplementary certificate)
-
* These finishes meet the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.
-
This supplement describes the manufacturer's capability to produce printed boards which feature control of characteristic impedence, as described in clause 4.1.4 of BS 1233000-003.
Board types:
Rigid Double sided with plated-through holes BS 123200-003
Rigid Multilayer BS 123300-003
-
Materials: Epoxide Woven Glass
Board Size: 540 mm x 480 mm Maximum
No. of Layers: 22 Maximum
-
Conductors:
Minimum Width 100 µm ±50 µm
Minimum Spacing 100 µm ±50 µm
-
Plated-through hole: Minimum Diameter 0.3 mm finished hole
Aspect Ratio: 11 : 1 Maximum
Impedance Demonstrated: 50 Ohms
Declared Tolerance: ±10 %
-
Geometries: Stripline, Microstrip
Upload additionnal document:
Manufacturer
:
Circast Electronics Limited
Place
:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.
Date of
cancellation
:
Issue date:
2007-05-10
Copyright © IEC-IECQ 2024 , Geneva Switzerland. All rights reserved.
This Certificate has intentionally NOT been printed as the Certificates are the property of the issuing CB.
For further information or to request a copy of a Certificate please contact the relative issuing CB.
http://www.iecq.org/membership/participating_countries/