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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0019

CB Certificate n�:
018/QCA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 165000-1 (Assessment Level PAL 8)

Issue No.:

Date of Issue of Detail Specification: 1996/05/01

Code(s) & Title(s):

ICI FHFIU - film and hybrid integrated circuits

Description of the technology:

Thick film hybrid integrated circuits.

Manufacturer:

SELEX Sensors and Airborne Systems Ltd
2 Crewe Toll North
Crewe Toll
EDINBURGH
Scotland
EH5 2XS
United Kingdom

Capability Manual Reference No:

MG 2247

Manufacturer's Approval No:

M1056 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation: 2006-11-07

Issue date: 2005/05/13


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0019	Issue No.: 8
		Page 2 of 2

Abstract of description of capability:

Manufacturer:  SELEX
Approved to:   BS EN 165000-1 : 1996 (The use of CECC STandards is permitted by the Basic Rules of the IECQ System; QC 001001 Amend. 1 Caluse 12.1)
-
Basic Technology:  Thick Film Passive and Hybrid Integrated Circuits
-
Construction: Substrate:   96% Aluminium Oxide
-
Conductors:  Gold, Platinum / Palladium – Gold, platinum / palladium – Silver
Up to 3 conductor layers
-
Resistors:  Ruthenium based, screen printed on ceramic or dielectric, laser trimmed to required value.
-
Assembly:  External terminations via glass-to-metal seals or side brazed pins
-
Add-on Components:  Diodes, transistors, integrated circuits, ceramic and tantalum capacitors, transformers, inductors and thin film resistor networks.
-
Method of attachment:  Conducting / non-conducting epoxies and soldering
(epoxies may be applied by screen printing or manual techniques)
-
Method of Interconnection: Thermosonic Gold and ultrasonic aluminium wire bonding
-
Packages and Sealing
1)   DIL metal cavity plug-in package, up to 80 leads and seal perimeter 250mm
2)  DIL ceramic side brazed cavity package, up to 56 leads and seal perimeter 187mm
3)  DIL metal cavity “butterfly” package, up to 80 leads and seal perimeter 250mm
-
Boundaries of Capability:
-
Resistor Range:  3 Ω to 6 MΩ
Tolerance:  0.5% (� 0.1Ω) typical
TCR Matching (Absolute):  � 100 to � 250 ppm / �C
TCR Matching (Tracking):  < 20 ppm / �C depending upon resistor values and ink series used
Resistor VCR:  20 ppm / V.cm for 1 MΩ paste
-:
Stability at maximum dissipation and voltage stress (2000 hours @ 125 �C)
-
Resistors Printed on Ceramic  Resistors Printed on Dielectric
10 Ω / square paste  < 2.0%  10 Ω / square paste  < 2.0%
30 Ω / square paste  < 1.0%  30 Ω / square paste  < 1.0%
100 Ω / square paste  < 0.5%  100 Ω / square paste  < 1.0%
300 Ω / square paste  < 0.5%  300 Ω / square paste  < 1.0%
1 kΩ / square paste  < 0.2%  1 kΩ / square paste  < 2.0%
10 kΩ / square paste  < 0.2%
100 kΩ / square paste  < 0.5%
1 MΩ / square paste  < 2.0%
-
Resistor Voltage Rating:  3.17 V / 0.001 inches maximum
-
Resistor Power Dissipation:  25 W / square inch maximum
-
Operating Temperature Range:  -55 �C to + 125 �C
-
Storage Temperature Range:  -65 �C to + 150 �C
-
Inspection and Test:  Assessment Level K, (screening to customer specification)
-
CECC 63000 Ref.-
4.5.9
Test: Sealing fine and gross leak
Conditions:   5 x 10-7 bar.cm� / sec
4.5.7
Test: Acceleration, steady state
Conditions:   49,000 m/s�
4.5.5
Test: Shock
Conditions: 14,700 m/s�, 0.5 ms
4.5.6
Test: Vibration
Conditions: 20 to 150 Hz, 49 m/s�; 55 to 500 Hz, 98 m/s2; 150 to 2 kHz, 196 m/s2
4.5.8
Test: Change of temperature
Conditions: - 65�C to + 150 �C
4.5.3
Test: Damp heat; steady state
Conditions:   56 days, 93% RH, 40 �C
4.5.15
Test: Resistance to solvents
4.5.10
Test: Solderability
Conditions: Test Ta method 1
4.5.11
Test: Resistance to soldering heat
Conditions:   Test Tb method 2 (size B iron)
4.5.12
Test: Tensile test
Conditions  Ua1,5 N
4.5.12
Test: Bending test (row)
Conditions:   Ub, 5 N
4.5.12
Test: Thrust test
Conditions:   Ua2, 1 N
-
Electrical Performance:  To customer detail specification
-
Customer participation in design:  Any degree by agreement

Upload additionnal document:

Manufacturer :

SELEX Sensors and Airborne Systems Ltd

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation: 2006-11-07

Issue date: 2005-05-13

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