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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0012

CB Certificate n�:
024/QCA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS 123000, Assessment Level C, ANSI/IPC-A-600F Class 2

Issue No.:

Date of Issue of Detail Specification:

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards:
Multilayer
Double-sided with plated-through holes
Single and double-sided with plain holes

Manufacturer:

Leicester Circuits (UK) Limited
41-45, The Warren
East Goscote Industrial Estate
East Goscote
Leicester
LE7 3XJ
United Kingdom

Capability Manual Reference No:

CM8

Manufacturer's Approval No:

M1026 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation:

Issue date: 2007/05/30


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0012	Issue No.: 3
		Page 2 of 2

Abstract of description of capability:

Board Types:
Rigid Multilayer: BS 123300-003
Rigid double-sided with plated-through holes: BS 123200-003
Rigid single and double-sided with plain holes: BS 123100-003
-
Base Materials: Epoxide Woven Glass
Board Size:  590mm  x  420mm     Maximum
No. of Layer:  14   Maximum
-
Conductors:
Minimum Width:       127mm     �25mm
Minimum Spacing:    127mm     �25mm
-
Plated-through Hole Diameter: 0.30mm   Miniminumfinished for component mounting
Aspect Ratio: 8 : 1 Maximum
-
Finishes:
*Hot Air Solder Levelling
*Immersion Gold; Electroless Nickel
*Electrolytic Gold; Electrolytic Nickel
Immersion Tin
Copper with Solderable Organic Protective Coating
Liquid Photoimagable Solder Resist
Notation Ink
Carbon Ink
-
Additional: Selective Electrolytic Nickel; nominal 12.5�m
-
*      These finishes meet the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.

Upload additionnal document:

Manufacturer :

Leicester Circuits (UK) Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation:

Issue date: 2007-05-30

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