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|  | IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
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| Abstract of description of capability: |
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| Basic Technology; Thick film passive and hybrid integrated circuits
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Construction:
Substrate: 96% Aluminium oxide
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Conductors: Gold, platinum/palladium-gold, platinum/palladium-silver. Up to 3 conductor layers.
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Resistors: Ruthenium based, screen printed, laser trimming.
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Assembly: External terminations via glass to metal seals or side brazed pins.
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Add-on Components; Diodes, transistors, integrated circuits, ceramic and tantalum capacitors, inductors, and thin film resistor networks.
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Method of attachment; Conducting/non-conducting epoxies and soldering (epoxies may be applied by screen printing and manual techniques)
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Method of interconnection; Thermosonic gold wire bonding and Ultrasonic aluminium wire bonding.
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Packages and sealing:
1. DIL metal cavity plug-in package, up to 80 leads and seal
perimeter 250mm.
2. DIL ceramic sidebrazed cavity package, up to 56 leads and
seal perimeter 187mm.
3. DIL metal cavity 'butterfly' package up to 80 leads and seal
perimeter 250mm.
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Boundaries of capability:
Resistor range: 3 Ohm - 6M Ohm
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Tolerance; 0.5% (±0.1 ) typical
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TCR Matching; (Absolute) ±100 - ±250 ppm/ºC
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TCR Matching; (Tracking) < 20 ppm/ºC depending on resistor values and ink series used.
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Resistor VCR; -20 ppm/V.cm for 1 MΩ paste
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Stability at maximum dissipation and voltage stress (2000 hours at 125ºC)
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Resistors on ceramic:
10 Ohm / sq paste< 2.0 %
30 Ohm / sq paste< 1.0 %
100 Ohm / sq paste < 1.0%
300 Ohm / sq paste< 0.5 %
1K Ohm / sq paste< 0.2 %
10K Ohm / sq paste< 0.2 %
100K Ohm / sq paste< 0.5 %
1M Ohm / sq paste< 2.0 %
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Resistors on dielectric:
10 Ohm / sq paste < 2.0%
30 Ohm / sq paste < 1.0%
100 Ohm / sq paste< 0.5 %
300 Ohm / sq paste < 1.0%
1K Ohm / sq paste < 2.0%
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Resistor Voltage Rating; 3.17V/0.001" max
Resistor Power dissipation; 25W/in² max
Operating temperature range; -55ºC to +125ºC
Storage temperature range; -65ºC to +150ºC
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Inspection & Test; Assessment Level K. Screening to customer specification
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BS CECC 63000 Ref Test Conditions Packages
4.5.9 Sealing fine & Gross leak 5 x 10 –7 bar.cm³/sec 1,2,3
4.5.7 Acceleration, steady 49000m/s² 1,2,3
4.5.5 Shock 14700m/s², 0.5ms 1,2,3
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IECQ 760000 Ref
4.5.6
Test
Vibration:
Conditions
20-150Hz, 49/s²: 1,2,3
55-500Hz, 98m/s²: 1,2,3
150-2000Hz, 196m/s² :1,2,3
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4.5.8
Test: Change of temperature
Conditions: -65ºC to +150ºC: 1,2,3
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4.5.3
Test
Damp heat, steady state.
Conditions: 56 Days, 93% RH, 40ºC: 1,2,3
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4.5.15
Test
Resistance to solvents
Conditions: - : 1,2,3
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4.5.10
Test: Solderability
Conditions: Test Ta method 1: 1,2,3
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4.5.11
Test: Resistance to soldering heat
Conditions: Test Tb method 2 size B iron: 1,2,3
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4.5.12
Test: Tensile test
Conditions: Ua1 5N: 1,2,3
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4.5.12
Test: Bending test (row)
Conditions: Ub 5N: 1,2,3
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4.5.12
Test: Thrust test
Conditions: Ua2, 1N :1,2
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Electrical performance: To customer detail specification
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Customer participation in design - Any degree by agreement
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Note: It may not be possible to achieve all the limits of capability in combination. |
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