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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
For rules and details of the IECQ visit
www.IECQ.org
IECQ Certificate n°:
C-IECQ BSI 06.0006
CB Certificate n°:
E083/CA
Issue No.:
7
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Status:
Cancelled
Page
1
of
2
Generic/Sectional Specification No.:
BS EN 123000
Issue No.:
1
Date of Issue of Detail Specification:
1992/01/01
Code(s) & Titl
e(s):
PWB FLWCU - printed wiring boards, flexible single-sided and double-sided without through connections
PWB FMTCU - printed wiring boards, flexible multilayer with through connections
PWB FRDTU - printed wiring boards, flex-rigid double-sided with through connections
PWB FRMTU - printed wiring boards, flex-rigid multilayer with through connections
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes
Description of the
technology
:
Rigid Printed Boards:
Single and double-sided with plain holes
Double-sided with plated through holes
Multilayer with trhough connections
-
Flexible / Flex-Rigid Printed Boards:
Single and double-sided without through-
connections
Double-sided with through connections
Flex-rigid multilayer with through connections
Flex-rigid double-sided with through connections
Multilayer with through connections
Manufacturer:
Teknoflex Limited
Quarry Lane
Chichester
West Sussex
PO19 8PE
United Kingdom
Capability Manual Reference No:
QM 420
Manufacturer's Approval No
:
M1044 IECQ-CECC
THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the
Official IECQ Website
.
Date of
cancellation
:
Issue date:
2008/08/13
- PAGE BREAK -
IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
For rules and details of the IECQ Scheme visit
www.IECQ.org
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Certificate No.:
C-IECQ BSI 06.0006
Issue No.:
7
Page
2
of
2
Abstract of description of
capability
:
Board Types:
Flex-rigid multilayer with through connections BS CECC 23600-801,
Flex-rigid double-sided with through connections,
Flexible multilayer with through connections,
Rigid double-sided with plated through holes,
Flexible multilayer,
Rigid single & double-sided with plain holes BS CECC 23100-801,
Flexible double-sided with through connections BS CECC 123500-003
Flexible single & double-sided without through connections.
-
Base Material:- Epoxide Woven Glass/Flexible Polymide Film
-
Board Size:
460 mm x 380 mm Maximum -Flexible Multilayer only
560 mm x 403 mm Maximum
-
Conductors:
Minimum Width: 150µm ±50µm
Minimum Spacing: 150µm ±50µm
-
No. of layers: 16 Maximum (10 for flex flying tail, 2 for flex hinge)
-
Plated-through Hole Diameter: 0.30mm Minimum
-
Aspect Ratio: 9 : 1 Maximum
-
Finishes:
Bare Copper
Hot Air Solder levelling *
5µm Gold on Copper Edge Contacts
2.5µm Gold on Nickel Edge Contacts
Adhesive Coated Film Coverlayer
Wet Film Solder Resist
Marking Ink - two pack
* These finishes meet the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.
Variant Codes are as defined in BS CECC 23600-801
Upload additionnal document:
Manufacturer
:
Teknoflex Limited
Place
:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.
Date of
cancellation
:
Issue date:
2008-08-13
Copyright © IEC-IECQ 2024 , Geneva Switzerland. All rights reserved.
This Certificate has intentionally NOT been printed as the Certificates are the property of the issuing CB.
For further information or to request a copy of a Certificate please contact the relative issuing CB.
http://www.iecq.org/membership/participating_countries/