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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
For rules and details of the IECQ visit
www.IECQ.org
IECQ Certificate n°:
C-IECQ BSI 05.0014
CB Certificate n°:
012/QCA
Issue No.:
4
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Status:
Cancelled
Page
1
of
2
Generic/Sectional Specification No.:
BS 123000 Assessment Level C, ANSI/IPC-A-600F Class 2
Issue No.:
0
Date of Issue of Detail Specification:
Code(s) & Titl
e(s):
PWB FLWCU - printed wiring boards, flexible single-sided and double-sided without through connections
PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes
Description of the
technology
:
Flexible Printed Boards:
Double sided with through connections
Single and double sided without through connections
Rigid Printed Boards:
Multilayer
Double sided with plated through holes
Single and double sided with plain holes
Manufacturer:
Flexible Technology Limited
Townhead
Rothesay
Isle of Bute
PA20 9JH
United Kingdom
Capability Manual Reference No:
FTM 102
Manufacturer's Approval No
:
M1013 IECQ-CECC
THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the
Official IECQ Website
.
Date of
cancellation
:
2008-01-21
Issue date:
2006/07/18
- PAGE BREAK -
IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
For rules and details of the IECQ Scheme visit
www.IECQ.org
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Certificate No.:
C-IECQ BSI 05.0014
Issue No.:
4
Page
2
of
2
Abstract of description of
capability
:
Board Types:
Flexible double sided with through connections: BS 123500-003
Flexible single and double sided without through connections: BS 123400-003
Rigid multilayer: BS 123300-003
Rigid double sided with plated through holes: BS 123200-003
Rigid single and double sided with plain holes:BS 123100-003
-
(The use of National Standards is permitted by the Basic Rules of the IECQ Systems; QC 001001:1998 clause 12.1)
-
Base Materials:
Epoxide Woven Glass
Polyimide Woven Glass
Polyimide Film
Acrylic Adhesive
-
Board Size:
300 mm x 225 mm Maximum Rigid
540 mm x 400 mm Maximum Flexible
-
Conductors: Minimum Width & Spacing: 150 µm ±50 µm
-
No. of Layers: 12 Maximum
-
Plated through hole diameter:
0.50 mm Minimum finished for component mounting
0.65 mm Minimum drilled via hole
-
Aspect Ratio: 3.08: 1 Maximum
Finishes:
*Hot Air Solder Levelling
Legend; UV Cured
-
* This finish meets the solderability requirements of IEC 60326-2; test methods 14b and 20a.
Upload additionnal document:
Manufacturer
:
Flexible Technology Limited
Place
:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.
Date of
cancellation
:
2008-01-21
Issue date:
2006-07-18
Copyright © IEC-IECQ 2024 , Geneva Switzerland. All rights reserved.
This Certificate has intentionally NOT been printed as the Certificates are the property of the issuing CB.
For further information or to request a copy of a Certificate please contact the relative issuing CB.
http://www.iecq.org/membership/participating_countries/