| CB |  | Certificate no. | IECQ Certificate No. | Company name | Issue Date | Status | FormUsed | |
41 | ABSQSG |  |
211 | AFNOR |  |
398 | ARES |  |
295 | BSI |  |
305 | CCATS |  |
523 | CEP |  |
2 | CESICERT |  |
3 | DEKRA |  |
260 | DNVCN |  |
90 | DNVTW |  |
121 | DNVUS |  |
7 | IECQDEMO |  |
68 | IMSGB |  |
57 | INTEKCN |  |
720 | KTL |  |
625 | LCIE |  |
44 | LLOYDSTW |  |
18 | LQASCCN |  |
724 | MOODY |  |
271 | NOA |  |
2469 | NQAGB |  |
23 | NSAIUS |  |
315 | POSI |  |
160 | SAIG |  |
2238 | SGSCN |  |
56 | SGSHK |  |
624 | SGSTW |  |
46 | TUVNCN |  |
147 | TUVNTW |  |
9 |  | 2025 |  |
30 | | 2024 |  |
 |  |  | QC021 (Rev. 8) | IECQ-H TUVNTW 09.0022 Issue 8 | Weltrend Semiconductor In... | 2024/10/12 | Current | 29.2.1 |  |
| | | QC022 (Rev. 6) | IECQ-H TUVNTW 09.0025 Issue 6 | Hony Glass Technology Co.... | 2024/10/26 | Current | 29.2.2 |  |
 |  |  | QC028-1 (Rev. 2) | IECQ-H TUVNTW 24.0003-01 Issue 2 | FOXCONN (KUNSHAN) COMPUTE... | 2024/12/09 | Current | 29.2.3 |  |
| | | QC028-10 (Rev. 2) | IECQ-H TUVNTW 23.0007 Issue 2 | FUHONG PRECISION COMPONEN... | 2024/12/09 | Current | 29.2.4 |  |
 |  |  | QC028-11 (Rev. 2) | IECQ-H TUVNTW 23.0008 Issue 2 | NEW WING INTERCONNECT TEC... | 2024/12/09 | Current | 29.2.5 |  |
| | | QC028-2 (Rev. 2) | IECQ-H TUVNTW 24.0003-02 Issue 2 | Huaian Fulitong Trade Co.... | 2024/12/09 | Current | 29.2.6 |  |
 |  |  | QC028-3 (Rev. 2) | IECQ-H TUVNTW 24.0003-03 Issue 2 | FOXCONN ELECTRONIC INDUST... | 2024/12/09 | Current | 29.2.7 |  |
| | | QC028-4 (Rev. 2) | IECQ-H TUVNTW 24.0003-04 Issue 2 | Fuyu Electronical Technol... | 2024/12/09 | Current | 29.2.8 |  |
 |  |  | QC028-5 (Rev. 2) | IECQ-H TUVNTW 24.0003-05 Issue 2 | FUDING PRECISION COMPONEN... | 2024/12/09 | Current | 29.2.9 |  |
| | | QC028-6 (Rev. 2) | IECQ-H TUVNTW 24.0003-06 Issue 2 | FuDing Precision Industry... | 2024/12/09 | Current | 29.2.10 |  |
 |  |  | QC028-7 (Rev. 2) | IECQ-H TUVNTW 24.0003-07 Issue 2 | Chongqing Hongteng Techno... | 2024/12/09 | Current | 29.2.11 |  |
| | | QC028-8 | IECQ-H TUVNTW 24.0003-08 Issue 1 | Sound Solutions (Zhenjian... | 2024/12/09 | Current | 29.2.12 |  |
 |  |  | QC028-9 | IECQ-H TUVNTW 24.0003-09 Issue 1 | Sound Solutions (Zhenjian... | 2024/12/09 | Current | 29.2.13 |  |
| | | QC028 (Rev. 2) | IECQ-H TUVNTW 24.0003 Issue 2 | FOXCONN ELECTRONIC INDUST... | 2024/12/09 | Current | 29.2.14 |  |
 |  |  | QC043-1 (Rev. 6) | IECQ-H TUVNTW 12.0021-01 Issue 6 | ChipMOS TECHNOLOGIES INC. | 2024/09/04 | Current | 29.2.15 |  |
| | | QC043-2 (Rev. 7) | IECQ-H TUVNTW 12.0021-02 Issue 7 | ChipMOS TECHNOLOGIES INC. | 2024/09/04 | Current | 29.2.16 |  |
 |  |  | QC043-3 (Rev. 6) | IECQ-H TUVNTW 12.0021-03 Issue 6 | ChipMOS TECHNOLOGIES INC. | 2024/09/04 | Current | 29.2.17 |  |
| | | QC043-4 (Rev. 5) | IECQ-H TUVNTW 12.0021-04 Issue 5 | ChipMOS TECHNOLOGIES INC. | 2024/09/04 | Current | 29.2.18 |  |
 |  |  | QC043-5 | IECQ-H TUVNTW 12.0021-05 Issue 1 | ChipMOS TECHNOLOGIES INC. | 2024/09/04 | Current | 29.2.19 |  |
| | | QC043 (Rev. 7) | IECQ-H TUVNTW 12.0021 Issue 7 | ChipMOS TECHNOLOGIES INC. | 2024/09/04 | Current | 29.2.20 |  |
 |  |  | QC099-1 (Rev. 2) | IECQ-H TUVNTW 21.0003-01 Issue 2 | QST International Corp. | 2024/08/30 | Current | 29.2.21 |  |
| | | QC099-2 (Rev. 2) | IECQ-H TUVNTW 21.0003-02 Issue 2 | QST International Corp. | 2024/08/30 | Current | 29.2.22 |  |
 |  |  | QC099 (Rev. 2) | IECQ-H TUVNTW 21.0003 Issue 2 | QST International Corp. | 2024/08/30 | Current | 29.2.23 |  |
| | | QC108 (Rev. 2) | IECQ-H TUVNTW 22.0007 Issue 2 | Universal Scientific Indu... | 2024/11/15 | Current | 29.2.24 |  |
 |  |  | QC117 | IECQ-H TUVNTW 24.0004 Issue 1 | HUAI I PRECISION TECHNOLO... | 2024/03/12 | Cancelled | 29.2.25 |  |
| | | QC119 | IECQ-H TUVNTW 24.0005 Issue 1 | British Cayman Islands In... | 2024/03/27 | Current | 29.2.26 |  |
 |  |  | QC122 | IECQ-H TUVNTW 24.0006 Issue 1 | Easy Biomedlical Co., Ltd... | 2024/11/07 | Current | 29.2.27 |  |
| | | TW-HSPM-1350 (Rev. 8) | IECQ-H TUVNTW 09.0006 Issue 8 | Sunplus Technology Co., L... | 2024/04/04 | Current | 29.2.28 |  |
 |  |  | TW-HSPM-1371 (Rev. 8) | IECQ-H TUVNTW 09.0019 Issue 8 | Holtek Semiconductor Inc. | 2024/08/01 | Current | 29.2.29 |  |
| | | TW-HSPM-1557 (Rev. 5) | IECQ-H TUVNTW 15.0002 Issue 5 | JORJIN TECHNOLOGIES INC. | 2024/03/21 | Current | 29.2.30 |  |
13 |  | 2023 |  |
9 | | 2022 |  |
3 |  | 2021 |  |
5 | | 2020 |  |
10 |  | 2019 |  |
2 | | 2018 |  |
4 |  | 2017 |  |
11 | | 2016 |  |
9 |  | 2015 |  |
11 | | 2014 |  |
10 |  | 2013 |  |
14 | | 2012 |  |
2 |  | 2011 |  |
2 | | 2010 |  |
3 |  | 2009 |  |
275 | TUVRTW |  |
167 | TUVSKR |  |
4 | TUVSUDSG |  |
526 | ULTW |  |
11833 | |  |