IECQ Online - Approval Certificate

IECQ Website > IECQ Certification Database > Approval Certificate

IECQ Guest User | Login

certificates.iecq.org:

i. home / search

ii. IECQ website

iii. Export data to Excel

View by:

i. Carbon Footprint

ii. Approved Process

iii. Approved Component

iv. ECMP - Avionics

ECMP - Avionics

v. IECQ HSPM Company

IECQ HSPM company

vi. Independent Testing

Indep. Testing Lab.

vii. IECQ HSPM Training

viii. Organization Approval

ix. Approval Certificate

x. CB Certificate Number

xi. Client, Component

IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0016

CB Certificate n�:
E030/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123000/300/200/100

Issue No.:

Date of Issue of Detail Specification: 1992/04/01

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Manufacturer:

Merlin Circuit Technology Ltd
Hawarden Industrial Park
Manor Lane
Deeside
Flintshire
North Wales
CH5 3QZ
United Kingdom

Capability Manual Reference No:

CM 401

Manufacturer's Approval No:

M1029 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation: 2006-03-17

Issue date: 2006/02/06


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0016	Issue No.: 12
		Page 2 of 2

Abstract of description of capability:

Board Types:
Rigid Multilayer - BS CECC 23 300-003
Rigid double sided with plated through holes - BS CECC 23 200-003
Rigid single and double sided with plain holes - BS CECC 23 100-003
-
Base Materials: Epoxide Woven Glass
-
Board Size:  406 mm x 558 mm, Maximum
Number of Layers: 22, Maximum
-
Conductors:
Minimum Width: 100 �m �20 �m
Minimum Spacing: 100 �m �20 �m
-
Plated through Hole Diameter:
0.6 mm Minimum (finished) for component mounting
0.3 mm Minimum (drilled) via hole
-
Aspect Ratio:  8:1 Max
-
Finishes:
*Immersion Gold; Electroless Nickel
*Hot Air Solder Levelling
*Tin-Lead; Electroplated and Fused
5 �m Gold on Copper Edge Contacts
2.5 �m Gold on Nickel Edge Contacts
0.7 �m Gold on Nickel Edge Contacts
Solder Resist; Wet; UV Cured
Solder Resist; Wet; Heat Cured
Solder Resist; Liquid Photopolymer
Solder Resist; Dry Film
Notation Ink; UV / Thermal Cured
Additional:
Bonded Heatsinks
-Anodised Aluminium
-Nickel plated Copper
-
* These finishes meet the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.

Upload additionnal document:

Manufacturer :

Merlin Circuit Technology Ltd

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation: 2006-03-17

Issue date: 2006-02-06

Loading...