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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0006

CB Certificate n�:
E077/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123 000/300/200/100

Issue No.:

Date of Issue of Detail Specification: 1992/03/01

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards:
Multilayer
Double-sided with plated-through holes
Single and double-sided with plain holes

Manufacturer:

Printech Circuit Laboratories Limited
31 – 35 Haltwhistle Road
South Woodham Ferrers
Chelmsford
Essex
CM3 5ZA
United Kingdom

Capability Manual Reference No:

CAM2000

Manufacturer's Approval No:

M1037 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation: 2006-06-21

Issue date: 2006/06/01


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0006	Issue No.: 6
		Page 2 of 2

Abstract of description of capability:

Board types:
Rigid Single and double sided with plain holes  BS CECC 23100-003
Rigid Double sided with plated-through holes  BS CECC 23200-003
Rigid Multilayer  BS CECC 23300-003
-
Material:  Epoxide Woven Glass
-
Board Size:  560 mm  x  458 mm  Maximum
-
No. of Layers:
24  Maximum  - BS CECC 23300-003
-
Conductors:
Minimum Width:127 �m  �50 �m
Minimum Spacing:127 �m  �50 �m
-
Plated-through hole:
Minimum Diameter:0.5 mm  finished component hole, 0.2 mm  drilled via hole
-
Aspect Ratio:  8 : 1  Maximum
-
Finishes:
*Hot Air Solder Levelling
*Immersion Gold over Electroless nickel
5�m Gold on Copper Edge Contacts
Silk screened Solder Resist (Photo-imageable)
Legend; UV Cured
-
*     These finishes meet the solderability requirements of IEC 60326-2; Test methods 14b and 20a.

Upload additionnal document:

Manufacturer :

Printech Circuit Laboratories Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation: 2006-06-21

Issue date: 2006-06-01

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