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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0009

CB Certificate n�:
E037/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123 000/500/400/300/200/100 Level C

Issue No.:

Date of Issue of Detail Specification:

Code(s) & Title(s):

PWB FLWCU - printed wiring boards, flexible single-sided and double-sided without through connections
PWB FRDTU - printed wiring boards, flex-rigid double-sided with through connections
PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Flexible Printed Boards:
Double sided with through connections
Single and double sided without through connections
-
Rigid Printed Boards:
Multilayer
Double sided with plated through holes
Single and double sided with plain holes

Manufacturer:

Flexible Technology Limited
Townhead
Rothesay
Bute
PA20 9JH
United Kingdom

Capability Manual Reference No:

FTM 102

Manufacturer's Approval No:

M1013 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation: 2008-01-21

Issue date: 2006/07/18


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0009	Issue No.: 7
		Page 2 of 2

Abstract of description of capability:

Board Types;
Flexible:
Double sided with through connections   -BS  CECC 123 500-003
Single and double sided without through connections  -BS  CECC 123 400-003
-
Rigid:
Multilayer:BS  CECC 23 300-003 and CECC 23 300-002
Double sided with plated through holes:  BS  CECC 23 200-003 and CECC 23 200-002
Single and double sided with plain holes:BS  CECC 23 100-003 and CECC 23 100-002
-
Base Materials:
Epoxide Woven Glass
Polyimide Woven Glass
Polyimide Film
Acrylic Adhesive
-
Board Size:
300 mm  x   225 mm ;   Maximum   Rigid
540 mm  x   400 mm  ;  Maximum   Flexible
-
Conductors:
Minimum Width:     150 �m   �50 �m
Minimum Spacing:  150 �m    �50 �m
-
No. of Layers:  12    Maximum   Rigid
-
Plated through:  0.50 mm    Minimum   (finished)
Hole Diameter:  0.65 mm    Minimum   (drilled)
-
Aspect Ratio:  3.08  :  1  Maximum
-
Finishes:
*Hot Air Solder Levelling
Legend; UV Cured
-
*These finishes meet the solderability requirement of IEC 326-2; Test Methods 14b and 20a.

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Manufacturer :

Flexible Technology Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation: 2008-01-21

Issue date: 2006-07-18

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