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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0005

CB Certificate n�:
E087/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123 000

Issue No.:

Date of Issue of Detail Specification: 1992/03/01

Code(s) & Title(s):

PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards;
Single and double-sided with plain holes
Double-sided with plated-through holes

Manufacturer:

GSPK Circuits Limited
Manse Lane
Knaresborough
North Yorkshire
HG5 8LF
United Kingdom

Capability Manual Reference No:

QM 05

Manufacturer's Approval No:

M1015 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation:

Issue date: 2004/05/14


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0005	Issue No.: 2
		Page 2 of 2

Abstract of description of capability:

Board types:
Rigid Single and double sided with plain holes  BS CECC 23100-003
Rigid Double sided with plated-through holes  BS CECC 23200-003
-
Material:  Epoxide Woven GlassEpoxide cellulose paper core, epoxide glass cloth surfaces
-
Board Size:
610 mm  x  460 mm -   EN 123100
610 mm  x  510 mm -   EN 123200
-
Conductors:
Minimum Width:      200 �m  �50 �m
Minimum Spacing:  200 �m  �50 �m
-
Plated-through hole:  Minimum Diameter -  0.3 mm  finished hole
-
Aspect Ratio:  5.8 : 1  Maximum
-
Finishes:
*Hot Air Solder Levelling
*Roller Coated
Wet Film Solder Resist; UV Cured
Liquid Photopolymer Solder Resist
Legend; UV Cured
-
* These finishes meet the solderability requirements of  IEC 60326-2; test methods 14b and 20a.

Upload additionnal document:

Manufacturer :

GSPK Circuits Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation:

Issue date: 2004-05-14

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