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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0010

CB Certificate n�:
E021/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123000/300/200/100 Level C

Issue No.:

Date of Issue of Detail Specification:

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards: Multilayer
Double sided with plated through holes
Single and double-sided with plain holes

Manufacturer:

CC Electronics Europe Limited
Wharton Industrial Estate
Nat Lane
Winsford
Cheshire
CW7 3BS
United Kingdom

Capability Manual Reference No:

CM/CCY6

Manufacturer's Approval No:

M1064 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation: 2007-05-18

Issue date: 2004/03/22


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0010	Issue No.: 8
		Page 2 of 2

Abstract of description of capability:

Board Types:
Rigid Multilayer:         BS CECC 23 300-003
Rigid double sided with plated through holes:         BS CECC 23 200-003
Rigid single and double sided with plain holes:        BS CECC 23 100-003
-
Base Materials:Epoxide Woven Glass
-
Board Size:
559 mm x 375 mm Maximum
Number of Layers:16 Maximum
-
Conductors:
Minimum Width:       100 �m     �50 �m
Minimum Spacing:    100 �m     �50 �m
-
Plated through Hole Diameter:
0.35 mm Minimum (finished) for component mounting
0.40 mm Minimum (drilled) via hole
-
Aspect Ratio:6.4  :  1  Maximum
-
Finishes:
*Hot Air Solder Levelling
Electroplated Copper
*Electroless gold over Immersion Nickel
*Immersion Tin
2.5�m Gold on Copper Edge Contacts
Solder resist wet Photoimagable Thermal Cured
Legend UV Cured and Two Pack Thermal Cured
Carbon Ink UV Cured
-
*  These finishes meet the solderability requirements of IEC 60326-2; Test methods 14b and 20a.

Upload additionnal document:

Manufacturer :

CC Electronics Europe Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation: 2007-05-18

Issue date: 2004-03-22

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