|
| CB |  | Certificate no. | IECQ Certificate No. | Company name | Issue Date | Status | FormUsed | |
|---|
| 41 |  ABSQSG | |
| 208 | AFNOR | |
| 398 | ARES | |
| 297 | BSI | |
| 284 | CCATS | |
| 513 | CEP | |
| 2 | CESICERT | |
| 3 | DEKRA | |
| 254 | DNVCN | |
| 90 |  DNVTW | |
| 7 | | 2025 | |
| | | TW-HSPM-1050-1 (Rev. 4) | IECQ-H DNVTW 16.0003-01 Issue 4 | Top Union Electronics Cor... | 2025/01/21 | Current | 10.1.1 | |
| | | TW-HSPM-1050-2 (Rev. 4) | IECQ-H DNVTW 16.0003-02 Issue 4 | Top Union Electronics Cor... | 2025/01/21 | Current | 10.1.2 | |
| | | TW-HSPM-1050 (Rev. 4) | IECQ-H DNVTW 16.0003 Issue 4 | Top Union Electronics Cor... | 2025/01/21 | Current | 10.1.3 | |
| | | TW-HSPM-1449-1 (Rev. 4) | IECQ-H DNVTW 17.0005 Issue 4 | Kinpo Electronics (China)... | 2025/02/18 | Current | 10.1.4 | |
| | | TW-HSPM-1449-2 (Rev. 4) | IECQ-H DNVTW 17.0006 Issue 4 | Cal-Comp Electronics & Co... | 2025/02/18 | Current | 10.1.5 | |
| | | TW-HSPM-1449 (Rev. 4) | IECQ-H DNVTW 17.0004 Issue 4 | Kinpo Electronics Inc. | 2025/02/18 | Current | 10.1.6 | |
| | | TW-HSPM-858263 | IECQ-H DNVTW 25.0001 Issue 1 | MitraStar Technology Corp... | 2025/03/04 | Current | 10.1.7 | |
| 22 | | 2024 | |
| 3 | | 2023 | |
| 5 | | 2022 | |
| 6 | | 2021 | |
| 1 | | 2020 | |
| 9 | | 2019 | |
| 4 | | 2018 | |
| 5 | | 2017 | |
| 2 | | 2016 | |
| 5 | | 2015 | |
| 11 | | 2014 | |
| 10 | | 2013 | |
| 121 | DNVUS | |
| 7 | IECQDEMO | |
| 68 | IMSGB | |
| 57 | INTEKCN | |
| 720 | KTL | |
| 618 | LCIE | |
| 43 | LLOYDSTW | |
| 11 | LQASCCN | |
| 708 | MOODY | |
| 239 | NOA | |
| 2420 | NQAGB | |
| 23 | NSAIUS | |
| 287 | POSI | |
| 160 | SAIG | |
| 2197 | SGSCN | |
| 56 | SGSHK | |
| 614 | SGSTW | |
| 44 | TUVNCN | |
| 149 | TUVNTW | |
| 275 | TUVRTW | |
| 167 | TUVSKR | |
| 4 | TUVSUDSG | |
| 521 | ULTW | |
| 11599 | | |
|
|