|
| CB |  | Certificate no. | IECQ Certificate No. | Company name | Issue Date | Status | FormUsed | |
|---|
| 41 |  ABSQSG | |
| 197 | AFNOR | |
| 398 | ARES | |
| 291 | BSI | |
| 240 | CCATS | |
| 493 | CEP | |
| 2 | CESICERT | |
| 247 | DNVCN | |
| 85 | DNVTW | |
| 121 | DNVUS | |
| 5 | IECQDEMO | |
| 68 | IMSGB | |
| 58 | INTEKCN | |
| 720 | KTL | |
| 599 | LCIE | |
| 43 |  LLOYDSTW | |
| 6 | | 2024 | |
| | | BJG00001439 (Rev. 3) | IECQ-H LLOYDSTW 20.0003 Issue 3 | COMPEQ MANUFACTURING (CHO... | 2024/06/28 | Current | 16.1.1 | |
| | | BJG00001962 | IECQ-H LLOYDSTW 24.0001 Issue 1 | Jiangsu Semicon Champion ... | 2024/05/22 | Current | 16.1.2 | |
| | | BJG00002466 (Rev. 3) | IECQ-H LLOYDSTW 21.0002 Issue 3 | COMPEQ TECHNOLOGY (HUIZHO... | 2024/08/15 | Current | 16.1.3 | |
| | | PRC-HSPM-1580 (Rev. 10) | IECQ-H LLOYDSTW 09.0001 Issue 10 | Gallopwire Technology In... | 2024/02/20 | Current | 16.1.4 | |
| | | TW-HSPM-1359 (Rev. 9) | IECQ-H LLOYDSTW 09.0002 Issue 9 | King Core Electronics Inc... | 2024/05/22 | Current | 16.1.5 | |
| | | TW-HSPM-1447 (Rev. 8) | IECQ-H LLOYDSTW 11.0001 Issue 8 | COMPEQ MANUFACTURING CO.,... | 2024/05/25 | Current | 16.1.6 | |
| 9 | | 2023 | |
| 14 | | 2022 | |
| 2 | | 2021 | |
| 4 | | 2019 | |
| 2 | | 2017 | |
| 1 | | 2014 | |
| 2 | | 2013 | |
| 1 | | 2011 | |
| 1 | | 2010 | |
| 1 | | 2008 | |
| 7 | LQASCCN | |
| 638 | MOODY | |
| 207 | NOA | |
| 2355 | NQAGB | |
| 23 | NSAIUS | |
| 261 | POSI | |
| 217 | SAIG | |
| 2130 | SGSCN | |
| 56 | SGSHK | |
| 602 | SGSTW | |
| 41 | TUVNCN | |
| 145 | TUVNTW | |
| 272 | TUVRTW | |
| 155 | TUVSKR | |
| 4 | TUVSUDSG | |
| 508 | ULTW | |
| 11229 | | |
|
|