|
| CB |  | Certificate no. | IECQ Certificate No. | Company name | Issue Date | Status | FormUsed | |
|---|
| 41 |  ABSQSG | |
| 195 | AFNOR | |
| 398 | ARES | |
| 290 | BSI | |
| 232 | CCATS | |
| 486 | CEP | |
| 2 | CESICERT | |
| 247 | DNVCN | |
| 85 | DNVTW | |
| 121 | DNVUS | |
| 5 | IECQDEMO | |
| 68 | IMSGB | |
| 58 | INTEKCN | |
| 720 | KTL | |
| 599 | LCIE | |
| 43 |  LLOYDSTW | |
| 6 | | 2024 | |
| 9 | | 2023 | |
| | | BJG00000720 (Rev. 2) | IECQ-H LLOYDSTW 20.0004 Issue 2 | Truly (Renshou) High-End ... | 2023/07/31 | Current | 16.2.1 | |
| | | BJG00000806 (Rev. 2) | IECQ-H LLOYDSTW 20.0005 Issue 2 | Truly Opto-Electronics Re... | 2023/07/31 | Current | 16.2.2 | |
| | | BJG00000887 (Rev. 4) | IECQ-H LLOYDSTW 19.0002 Issue 4 | Laird Technologies (Shang... | 2023/09/26 | Current | 16.2.3 | |
| | | BJG00001777 (Rev. 2) | IECQ-H LLOYDSTW 21.0001 Issue 2 | FCI Connectors Dongguan L... | 2023/12/07 | Current | 16.2.4 | |
| | | BJG00001899 | IECQ-H LLOYDSTW 23.0001 Issue 1 | Semiconductor Manufacture... | 2023/03/17 | Current | 16.2.5 | |
| | | KPC-5378 (Rev. 3) | IECQ-H LLOYDSTW 20.0006 Issue 3 | O-Flex Co., Ltd. | 2023/11/13 | Current | 16.2.6 | |
| | | PRC-HSPM-1843 (Rev. 7) | IECQ-H LLOYDSTW 11.0002 Issue 7 | COMPEQ MANUFACTURING (HUI... | 2023/01/15 | Current | 16.2.7 | |
| | | PRC-HSPM-2368 (Rev. 4) | IECQ-H LLOYDSTW 17.0004 Issue 4 | Alpha Assembly Solutions ... | 2023/07/31 | Current | 16.2.8 | |
| | | TWN00000362 | IECQ-H LLOYDSTW 23.0002 Issue 1 | Hon Young Semiconductor C... | 2023/11/20 | Current | 16.2.9 | |
| 14 | | 2022 | |
| 2 | | 2021 | |
| 4 | | 2019 | |
| 2 | | 2017 | |
| 1 | | 2014 | |
| 2 | | 2013 | |
| 1 | | 2011 | |
| 1 | | 2010 | |
| 1 | | 2008 | |
| 3 | LQASCCN | |
| 635 | MOODY | |
| 199 | NOA | |
| 2348 | NQAGB | |
| 23 | NSAIUS | |
| 255 | POSI | |
| 217 | SAIG | |
| 2123 | SGSCN | |
| 56 | SGSHK | |
| 599 | SGSTW | |
| 39 | TUVNCN | |
| 145 | TUVNTW | |
| 273 | TUVRTW | |
| 154 | TUVSKR | |
| 4 | TUVSUDSG | |
| 508 | ULTW | |
| 11171 | | |
|
|