 | Certificate n°:
US-HSPM-1004 | Issued: | 2006/11/09 |
DB Registration n°:
HC-IECQ ECCB 07.0035 | Revision: | 1 |
| Expiration: | 2009/11/08 |
| Status: | Cancelled |
IECQ Certificate of Hazardous Substance Process Management (HSPM)
European Directive 2002/95/EC ("RoHS") requirementsThe Supervising Inspectorate (ECCB) and the National Standards Authority of Ireland, Inc. Certify thatWAFERTECH 5509 N.W. Parker Street
Camas, WA 98607, USA United States of America
Has developed and implemented Hazardous Substance Process Management, procedures and related processes in compliance with the applicable requirements for HSPM organization approval which is in accordance with the Basic Rules IECQ-01 and Rules of Procedure QC 001002-5 "IECQ Hazardous Substances Process Management" of the IEC Quality Assessment System for Electronic Components (IECQ), and with respect to the Specification QC 080000. |
This Certification is applicable to
all electronic components and related materials and processes for the |
WaferTech (a TSMC company, Fab11) provides semiconductor IC manufacturing services for worldwide design houses and companies, excluding design/development functions. Certificate Cancelled at request of Organization; effective date 2009-02-18 |
Issued by Certification Authorities: |
| |
National Standards Authority of Ireland, Inc.
402 Amherst Street, Suite 304
NASHUA, NH 03063
US | Electronic Components Certification Board
c/o JV Chapman
PO Box 9041,
Midland, Texas 79708.
US |
|
The validity of this certificate is maintained through on-going surveillance inspections.
Note: This certificate is valid only in conjunction with the approval document(s). This approval and this
certificate may be suspended or withdrawn in accordance with the Rules of Procedure of the IECQ. This
certificate remains the property of the body which granted it.
(*)HSPM: Hazardous Substance Process Management |