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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0003

CB Certificate n�:
E003/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123 000/100/200/300

Issue No.:

Date of Issue of Detail Specification: 1992/03/01

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards;
Single and double-sided with plain holes
Double-sided with plated-through holes
Multilayer

Manufacturer:

Circast Electronics Limited
Ramsey Road
Sydenham Industrial Estate
Leamington Spa
CV31 1PG
United Kingdom

Capability Manual Reference No:

CM/1/19

Manufacturer's Approval No:

M1063 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation: 2006-08-22

Issue date: 2005/03/01


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0003	Issue No.: 5
		Page 2 of 2

Abstract of description of capability:

Board types:
Rigid Single and double sided with plain holes  BS CECC 23100-003
Rigid Double sided with plated-through holes  BS CECC 23200-003
Rigid Multilayer                                            BS CECC 23300-003
-
Materials:  Epoxide Woven GlassPolyimide Woven Glass
-
Board Size:  540 mm  x  480 mm  Maximum
No. of Layers:24  Maximum     (Epoxide Woven Glass)18  Maximum     (Polyimide Woven Glass)
-
Conductors:
Minimum Width      100 �m  �50 �m
Minimum Spacing  100 �m  �50 �m
-
Plated-through hole:  Minimum Diameter  0.3 mm  finished hole
-
Aspect Ratio:  11 : 1  Maximum
-
Finishes:
*Hot Air Solder Levelling
Electroless Nickel; Immersion Gold
2.5 �m Gold on Copper Edge Contacts
2.5 �m Gold on 5�m Nickel Edge Contacts
Liquid Photopolymer Solder Resist
Wet Film Solder Resist
Legend; UV Cured
-
Additional Features:
Bonded Heatsinks:Anodised Aluminium, Nickel plated Copper
Blind and Buried via holes (sequential build)
Controlled Impedance (see supplementary certificate)
-
*        These finishes meet the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.
-
Board types:
Rigid Double sided with plated-through holes  BS CECC 23200-003
Rigid Multilayer  BS CECC 23300-003
-
Materials:  Epoxide Woven Glass
-
Board Size:  540 mm  x  480 mm  Maximum
No. of Layers:  22  Maximum
-
Conductors:
Minimum Width      100 �m  �50 �m
Minimum Spacing  100 �m  �50 �m
-
Plated-through hole:  Minimum Diameter  0.3 mm  finished hole
Aspect Ratio:  11 : 1  Maximum
Impedance Demonstrated:  50 Ohms
Declared Tolerance:  �10 %
-
Geometries:
Stripline
Microstrip

Upload additionnal document:

Manufacturer :

Circast Electronics Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation: 2006-08-22

Issue date: 2005-03-01

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