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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
For rules and details of the IECQ visit
www.IECQ.org
IECQ Certificate n°:
C-IECQ BSI 05.0013
CB Certificate n°:
014/QCA
Issue No.:
4
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Status:
Cancelled
Page
1
of
2
Generic/Sectional Specification No.:
BS EN 123 000/300/200/100 Assessment Level C
Issue No.:
0
Date of Issue of Detail Specification:
1992/01/01
Code(s) & Titl
e(s):
PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes
Description of the
technology
:
Rigid Printed Boards:
Multi-layer
Double sided with plated through holes
Single and double sided with plain holes
Manufacturer:
Irlandus Circuits Ltd
Annesborough 3
Craigavon
BT67 9JJ
Northern Ireland
United Kingdom
Capability Manual Reference No:
M-200
Manufacturer's Approval No
:
M1020 IECQ-CECC
THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the
Official IECQ Website
.
Date of
cancellation
:
2005-04-13
Issue date:
2004/05/21
- PAGE BREAK -
IEC QUALITY ASSEEEMENT SYSTEM
FOR ELECTRONIC COMPONENTS
(IECQ)
For rules and details of the IECQ Scheme visit
www.IECQ.org
CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)
Certificate No.:
C-IECQ BSI 05.0013
Issue No.:
4
Page
2
of
2
Abstract of description of
capability
:
Board Types:
Rigid Multi-layer: BS CECC 23 300-003
Rigid double sided with plated through holes: BS CECC 23 200-003
Rigid single and double sided with plain holes: BS CECC 23 100-003
-
(The use of CECC Standards is permitted by the Basic Rules of the IECQ System; QC 001001 Amend. 1 clause 12.1)
-
Base Material: Epoxide Woven Glass
Board Size: 535 mm x 420 mm Maximum
-
Conductors:
Minimum Width: 100 µm ± 20 µm
Minimum Spacing: 100 µm ± 20 µm
No. of layers 24 Maximum
-
Plated-through hole diameter:
0.5 mm Minimum finished for component mounting
0.2 mm Minimum drilled via hole
-
Aspect Ratio: 10 : 1 Maximum
-
Finishes:
*Electroplated Tin-Lead
*Fused Tin-Lead
*Hot Air Solder Levelling
2.5 µm Gold on Copper Edge Contacts
2.5 µm Gold on 2.5µm Nickel Edge Contacts
Wet Solder Resist; IR Cured
Liquid Photopolymer Solder Resist
Dry film Solder Resist
Legend Heat Cured
-
Additional: Bonded heatsinks:
Copper/Nickel Plated
Aluminium Anodised
Prepreg adhesive system
-
*These finishes meet the solderability requirements of IEC 60326-2; Test Methods 14b and 20a.
-
Variant codes are as defined in CECC 23 300-003.
Upload additionnal document:
Manufacturer
:
Irlandus Circuits Ltd
Place
:
Certificate issued by the following
Supervising Inspectorate
:
BSI Product Services
Milton Keynes,
United Kingdom
NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.
Date of
cancellation
:
2005-04-13
Issue date:
2004-05-21
Copyright © IEC-IECQ 2024 , Geneva Switzerland. All rights reserved.
This Certificate has intentionally NOT been printed as the Certificates are the property of the issuing CB.
For further information or to request a copy of a Certificate please contact the relative issuing CB.
http://www.iecq.org/membership/participating_countries/