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IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)

For rules and details of the IECQ visit www.IECQ.org

IECQ Certificate n�:
C-IECQ BSI 05.0001

CB Certificate n�:
E082/CA

Issue No.:

CAPABILITY APPROVAL CERTIFICATE
GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY
(QC 001002-3, clause 4)

Status:

Cancelled

Page 1 of 2

Generic/Sectional Specification No.:

BS EN 123 000, BS EN 123 300, BS EN 123 200, BS EN 123 100

Issue No.:

Date of Issue of Detail Specification: 1992/01/01

Code(s) & Title(s):

PWB RIMLU - printed wiring boards, rigid multilayer
PWB SDPHU - printed wiring boards, rigid single-sided and double-sided with plain holes
PWB SDPLU - printed wiring boards, rigid double-sided with plated-through holes

Description of the technology:

Rigid Printed Boards:
Multi-layer
Double-sided with plated-through holes
Single and double-sided with plain holes

Manufacturer:

Artetch Circuits Limited
Riverside Industrial Estate
Littlehampton
West Sussex
BN17 5DF
United Kingdom

Capability Manual Reference No:

ART/CM/03 Issue: 3 Date: December 2000

Manufacturer's Approval No:

M1002 IECQ-CECC

THE PRODUCTS COVERED BY THIS APPROVAL ARE DESCRIBED IN MORE DETAIL IN CAPABILITY ABSTRACT NUMBER:

Assessment Level: C

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

1. This certificate may only be reproduced in full.
2. This certificate is not transferable and remains the property of the issuing body.
3. The Status and authenticity of this certificate may be verified by visiting the Official IECQ Website.

Date of cancellation:

Issue date: 2004/12/07


		IEC QUALITY ASSEEEMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) For rules and details of the IECQ Scheme visit www.IECQ.org


CAPABILITY APPROVAL CERTIFICATE GRANTING THE RIGHT TO USE THE MARK OR DECLARATION OF CONFORMITY (QC 001002-3, clause 4)



Certificate No.:	C-IECQ BSI 05.0001	Issue No.: 4
		Page 2 of 2

Abstract of description of capability:

Board Types:
Rigid Multi-layer                                            BS CECC 23300-003  CECC 23300-005
Rigid double-sided with plated through holes  BS CECC 23200-003  CECC 23200-004
Rigid single and double-sided with plain holes  BS CECC 23100-003
Base Materials:  Epoxide Woven Glass
Board Size:  401 mm  x  366 mm     Maximum
Conductors:
Minimum Width:  150 �m �50 �m
Minimum Spacing:  150 �m �50 �m
Number of Layers:  24     Maximum
Plated-through Hole Diameter:
0.4 mm   Minimum  finished  for component mounting
0.5 mm  Minimum  drilled  via hole
Aspect Ratio:  7.6 : 1  Maximum
Finishes:  (Variant Code)
*  Hot Air Solder Levelling  SnPb
*  Immersion Silver  AgCu
*  2.5 mm Gold over Copper Edge Contacts  2.5AuCu
Liquid Photoimagable Solder Resist  LSM
Dry Film Solder Resist  DSM
Notation Ink  MI
*      These finishes meet the solderability requirements of IEC 326-2; Test Methods 14b and 20a.

Upload additionnal document:

Manufacturer :

Artetch Circuits Limited

Place:

Certificate issued by the following Supervising Inspectorate:

BSI Product Services
Milton Keynes,
United Kingdom

NOTE: This certificate is only valid in conjunction with the approval document(s). This Approval and this certificate may be suspended or withdrawn in accordance withe the Rules of Procedure of the IECQ. This certificate remains the property of the body which granted it.

Date of cancellation:

Issue date: 2004-12-07

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